Enabling Your Next Step

Qseven formed for mobility

New high performance and low power processors built using the 45 nm technology and new interfaces are expected to bring embedded PC technology to ultra mobile, battery operated applications. Unlike existing COM module standards the Qseven standard is specifically designed for mobile applications.
– The motivation to define the Qseven standard was that these new technologies make it possible to use X86 processors in applications where it hasn’t been possible before and therefore not an option to use COM modules either, says Patrik Björklund, Sales and marketing Manager at Hectronic AB one of the participating companies in the Qseven Consortium.

Using a COM module on a carrier board is a commonly considered strategy in embedded PC development. The advantages are increased flexibility and scalability. There are numerous form factors to choose from. ETX and COM Express are two alternatives.
– ETX is too big for mobile applications and has an old feature set, says Patrik Björklund. COM Express has a reasonably modern set of interfaces but no defined small form factor. The size of modules vary from one manufacturer to another.

Low power – Less heat

The small (70 mm x 70 mm) Qseven module based on low power processor technology is aimed to fit requirements for mobile applications. Since the defined power consumption in the standard is low (max. 12 watts) heat dissipation is kept at a minimum. Fanless operation is possible.

A 5 mm thermal cooling strip defined in the standard dissipates heat generated. The copper strip is thermally connected to heat-generating components such as CPU, chipset and memory through numerous contacts to the different layers of the board, through the layers themselves and the points where components are soldered. Thermal energy is directed from the cooling strip via metal blocks to the carrier board or the housing.

The Qseven standard defines an MXM card slot with 230 pins in a 0.5 mm configuration for connection between module and carrier board. Patrik Björklund admits that contacts in the COM Express standard are more stabile and rugged compared to Qseven.
– The Qseven contacts are good enough for most applications, he says, but the big issue here is cost.

Robust and small MXM connector on Qseven module

The MXM connector is affordable and well tried in laptops where it’s used for graphics cards. Robustness and small size was other reasons for choosing the MXM connector in the standard. To prevent malfunction in rough environments the module is mounted with 4 screws and spacers. The spacers are either 5 mm or 2.7 mm, depending on the height of the MXM connector.

Since one of the driving forces behind introducing the Qseven standard was to realize new embedded PC technology in ultra mobile applications “legacy interfaces” have had to make room for the newer standards. Parallel IDE and PCI Bus are examples of interfaces excluded.

– When designing a new application I would say that the interfaces included in the Qseven standard are relevant, says Patrik Björklund.

The Qseven standard defines the following interfaces:

• 2x SATA

• 8x USB 2.0

• 4x PCI Express x1 Lanes

• 1000BaseT Ethernet

• SDIO 8 Bit

• LVDS 2x 24 Bit

• SDVO / HDMI / DisplayPort (shared)

• HDA (High Definition Audio)
• LPC (Low Pin Count Bus)
• I²C Bus
• Battery Management
• Fan Control
• 5V Power (TDP max. 12 Watt)
• Application Programming Interface (API)

Should there be a need for legacy interfaces in a design there are still a possibilities. Patrik Björklund gives an example.
– There is an LPC bus to use implementing Super I/O for legacy interface purposes. It’s even possible to include an ISA bus on the carrier using an ISA bridge.

Qseven targets mobile applications specifically

The interfaces defined in the Qseven standard is targeting requirments from customers planning to realize new low power processor technology in mobile applications.

Standard software interface

Qseven modules have additional functions like Watchdog Timer, I²C Bus, LCD brightness control, BIOS user storage area and the reading of system temperatures. Until now there has existed no standard software interface for these functions leading to tedious adaptations when changing from one manufacturer’s module to another.

– In an ETX design, for instance, pin compatibility can be a problem, but more often drivers, says Patrik Björklund. Two manufacturers typically implement for instance I²C differently in software. Switching ETX module brand often lead to a carrier board or driver redesign.

Qseven has defined a software interface to avoid that problem and facilitate module exchange. An uncommon initiative among the companies in the consortium further improves module compatibility between different manufacturers.

– A group of member companies have joined forces to develop a reference carrier board, says Patrik Björklund.Modules from these manufacturers will be verified against the same carrier board. Thus customers can be sure that if their design works with one module it’s also highly likely to work with a module from one of the other manufacturers.

Hectronic has announced the H6049 Qseven module based on Intel Atom. Customers prioritizing cost effectiveness are targeted.

– I believe that customers likely to want to use Qseven modules at this stage are likely to look for low cost modules rather than fully featured ones, says Patrik Björklund.

The Qseven specification is freely available and may be used without any license fees. Membership in the Qseven consortium is also free of charge.

The Hectronic H6049 Qseven module with Intel Atom targets ultra compact designs such as testers, medical devices and rugged tablets.

Link to product information »

Qseven COM modules have additional functions like Watchdog Timer, I²C Bus, LCD brightness control, BIOS user storage area and the reading of system temperatures. Until now there has existed no standard software interface for these functions leading to tedious adaptations when changing from one manufacturer’s module to another.
– In an ETX design for instance pin compatibility isn’t the problem, says Patrik Björklund. Two manufacturers typically implement for instance I²C differently in software. Switching ETX module brand often lead to a carrier board or driver redesign.

Qseven has defined a software API to avoid that problem and facilitate module exchange. An uncommon initiative among the companies in the consortium further improves module compatibility between different manufacturers.
– A group of member companies have joined forces to develop a reference carrier board, says Patrik Björklund.

Modules from these manufacturers will be verified against the same carrier board. Thus customers can be sure that if their design works with one module it’s also highly likely to work with a module from one of the other manufacturers.

Hectronic has announced the H6049 Qseven module based on Intel Atom. Customers prioritizing cost effectiveness are targeted.
– I believe that customers likely to want to use Qseven modules at this stage are likely to look for low cost modules rather than fully featured ones, says Patrik Björklund.

The Qseven specification is freely available and may be used without any license fees. Membership in the Qseven consortium is also free of charge.

Enabling Your Next Step

Qseven formed for mobility

Low power – Less heat

Robust and small MXM connector on Qseven module

Standard software interface

Related Topics

The Qseven standard form factor