The H6059 is a compact (70mm x 70mm) high-performance, low power COM module based on the AMD G-series APUs with single or dual X86 cores and the A55E embedded chipset.The APUs have the powerful Radeon 6250 GPU built in. The Qseven form factor makes 6059 a legacy free module with a full range of contemporary low voltage differential serial interfaces such as PCI Express and USB 2.0 and display interfaces such as DisplayPort, DMI, DVI and LVDS. The BIOS supports legacy Super I/O on the carrier board.
Qseven modules are defined for low cost and ruggedness, with an MXM type edgecard connector interfacing the carrier board. H6059 has soldered memory and optional on-board SSD. Hectronic is planning to offer H6059 with optional conformal coating and to release versions for extended/industrial temperature range during 2012.
Features:
• AMD G-Series APU - Single/dual core
• Extended/Industrial Temperature optional
• Soldered DDRIII DRAM
• Onboard NANDrive Flash SSD
• 2 x SATA ports
• 4 x PCIe ports
• Gigabit Ethernet
• 8 x USB 2.0 Ports
• LVDS, Displayport, DVI/HDMI
• HD Audio
• RTC
• Fully RoHS compliant