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Qseven modules

New high performance, low power processors and new interfaces are expected to bring embedded PC technology to ultra-mobile, battery operated applications. Unlike existing COM module standards the Qseven standard is specifically designed for mobile applications.

The Qseven standard presents a small (70 mm x 70 mm) COM module with a low power consumption (max. 12 watts). Heat dissipation is kept at a minimum and fanless operation is possible.

An MXM card slot with 230 pins connects Qseven module with carrier board. The MXM connector is affordable and well tried in laptops. Robustness and small size was other reasons for choosing the MXM connector in the standard.

Since one of the driving forces behind introducing the Qseven standard was to realize new embedded PC technology in ultra mobile applications “legacy interfaces” have had to make room for the newer standards. Parallel IDE and PCI Bus are examples of interfaces excluded.

Hectronic H6059

AMD G-series APU

Q7-NT2

NVidia Tegra290 ARM Cortex A9 CPU

Hectronic H6055

Intel Atom E620T/E640T/E680T

Hectronic H6049

Intel Atom Z510/Z530

Hectronic H6049

Intel Atom Z510/Z530

The H6049 is an extremely compact high-performance, ultra low power COM module using the Intel Atom Z510/530 CPU and the US15W embedded chipset with integrated graphics and media hardware acceleration. The BIOS has support for legacy Super I/Os on the carrier board and the Trusted Platform Module (TPM 1.2) on the module.

The module is based on the new Qseven standard, for UMPC platforms, and is a legacy free module with the new serial interfaces and the latest display interfaces. Qseven standard modules are defined for low cost and ruggedness, with an edgecard connector for MXM-connectors on the carrier board.

H6049 is available in two additional versions specified for wider temperature ranges.

• Industrial Temperature (–40°C to +85°C)

• Extended Temperature (–25°C to +70°C)

Conformal coating of the board is optional.