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Qseven modules

 

New high performance, low power processors and new interfaces are expected to bring embedded PC technology to ultra-mobile, battery operated applications. Unlike existing COM module standards the Qseven standard is specifically designed for mobile applications.

The Qseven standard presents a small (70 mm x 70 mm) COM module with a low power consumption (max. 12 watts). Heat dissipation is kept at a minimum and fanless operation is possible.

 

An MXM card slot with 230 pins connects Qseven module with carrier board. The MXM connector is affordable and well tried in laptops. Robustness and small size was other reasons for choosing the MXM connector in the standard.

Since one of the driving forces behind introducing the Qseven standard was to realize new embedded PC technology in ultra mobile applications “legacy interfaces” have had to make room for the newer standards. Parallel IDE and PCI Bus are examples of interfaces excluded.

Qseven - Documentation

Qseven Specification Rev. 2.0 » 

Qseven Specification Rev. 1.2 »

Qseven Specification Rev. 1.1 » 

Qseven Design Guide Rev. 1.0 (Release candidate) »

 
Q7-IMX6
Freescale i.MX 6 Qseven module
Q7-TI8168
ARM Cortex A8 and TI C674x VLIW DSP core
Hectronic H6059
AMD G-series APU T16R/T40R/T40E
Q7-NT2
NVidia Tegra290 ARM Cortex A9 CPU
Hectronic H6055
Intel Atom E620T/E640T/E680T
Hectronic H6049
Intel Atom Z510/Z530
 
 
 
 

Qseven modules

- Versatile beyond expectations

 

Qseven is now a seriously established form factor. The popularity comes from compact size (70mm x 70mm), low height, cost efficiency and access to high-speed interfaces. 

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Relevant case studies

 

Semi-custom design in AGV

 

This unmanned forklift is used by Orrefors Kosta Boda AB for transportation of hot glass products to cooling ovens.

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Related Topics

 

Guides to carrier board development

For in-house developers we’d like to share some of our experiences and give introductions to the challenges involved.

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Determining plate fin heat sink parameters

 

How to use the physics and mathematics behind a plate fin sin sink to design a sufficient cooling device.

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Heat sink design in embedded systems
 

Flow simulation evaluates cooling methods

 

Hectronic uses SolidWorks Flow Simulation to simulate air flow, temperatures and hot spots.
- I can show to customers that the concept is working, says Guido Kats, Mechanical Engineer.

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Simulation supports design of heat reduction in embedded systems