One week into the new year of 2010 the Intel® Core™ i5 and Core™ i7 family of processors was released along with the QM57 chipset. The Nehalem architecture built in a 32nm process technology is now brought into the low power segment of notebooks and embedded systems. The benefits are size reduction and increased performance but the level of integration will challenge system designers, as the heat needs to be dissipated from fewer and smaller components.

Along come possibilities for the release of motherboards in Nano-ITX in performance levels typically reached by motherboards no smaller than Mini-ITX today. Intel® Core™ i5 and Core™ i7 will make way for high-performance applications based on COM modules and carrier boards. COM Express stands out as the perfect COM module form factor for these semi-custom applications.

Intel® Core™ i5 and Core™ i7 and the QM57 chipset can be regarded as the successor to Intel's Core 2 Duo processor platform, initially with the 945GM chipset and later with the GS45/GM45. The development continues towards high-performance computing in a smaller package. More compact embedded systems are thereby a possibility in the performance range equivalent to high-end notebook and desktop computers.

The graphical accelerator and the memory controller are placed on the CPU chip. It's one of the reasons behind the improvements. TDP (Thermal Design Power) of the processor CPU chip in the Core™ i5 and Core™ i7 processor families will therefore typically be higher compared to Core 2 Duo. Still performance per watt is improved. Higher level of integration in the CPU chip means that more heat is generated. To realize the possibilities for more compact embedded systems system designers are challenged with developing efficient enough cooling devices using less space.

The processor families are expected to be used in a wide variety of application types since there are numerous versions offered. Processors distinguished by a combination of high performance and high power consumption suits some applications to which somewhat bulky cooling devices are acceptable. Applications that require slim and passive cooling preferably use a processor version with lower power consumption and yet maintained performance, but the price will be higher. There are, or at least will be, a great number of variations available in terms of price, performance and power consumption.

In this performance segment smaller motherboards and SBCs will reach the market as a result of Intel's introduction. The lower limit in terms of size has typically been the Mini-ITX form factor with boards measuring 170mm x 170mm. Nano-ITX (120mm x 120mm) motherboards and 3.5 inch SBCs with matching performance levels will be introduced additionally. Perhaps one or two PC104 boards with Core™ i5 and Core™ i7 will reach the market as well.

A variety of module form factors are expected to be based on this processor platform, for instance AMC processor modules in MicroTCA systems, but the dominating form factor will be COM Express. COM Express is the perfect fit in terms of power consumption, computing performance and interfaces for COM modules based on these processors. The specification includes all the contemporary interfaces such as SDVO, LVDS, PCI Express, Gigabit Ethernet, SATA and the possibility for numerous USB ports. These are all interfaces supposedly required in the high performance applications targeted by Core™ i5 and Core™ i7 and the QM57 chipset.

The semi-custom design strategy is an option added to a group of applications that require extensive computing performance. Development projects that go for the semi-custom approach using a COM Express module based on Core™ i5 or Core™ i7 instead of using desktop motherboards or designing a MicroTCA system will enjoy a number of benefits. The benefits are the use of application specific I/O, realization of small and robust system designs that are less complex and less costly to assemble. These benefits come without compromising on performance requirements. It will further reinforce the trend towards using ready-made COM modules mounted on tailor-made carrier boards.

The contacts connecting the module on the carrier board are identical in size, functionality and placement in the COM Express basic form factor compared to its micro-sized sister version. The only difference is the placements of the screws mechanically fastening the module on the carrier board. Merely add two separate hole patterns on the carrier board and it is possible to use a Micro COM Express module as well as a COM Express basic form factor module on the same carrier board.

Such a system will benefit from scalability where computing performance is decided by the processor and chipset on the module. This flexibility along with the other advantages mentioned were why Hectronic didn't hesitate when choosing the Micro COM Express form factor for the company's first module released based on an Intel® Core™ i7, Core™ i5 (and Core™ i3) processors.

Apart from size the other major improvement compared to existing processor platforms is graphics. To date embedded applications, in which 3D graphic performance is required, have been restricted to special solutions involving graphics coprocessors, separate graphics controllers and cards as well as other components and solutions that all come at a price.

Power consumption is rising. Component life times for the most powerful components are typically two years at best. Compromises have been called for and just have had to be accepted since no other solution has been available. Intel® Core™ i5 and Core™ i7 offers significantly improved graphics compared to existing chipsets with embedded graphics and will make costly (in a wide sense) compromises unnecessary, in most cases.

Improved computing performance and graphics indicate that some particular market segments are likely to be the most interesting. Medical imaging, represented by for instance X-ray equipment and magnetic field cameras, is such an application segment. Radar systems in the Defence sector and navigation systems in Offshore/Marine area are other examples. Datacom and Telecom are expected to have their share of applications using this processor platform.

An Enterprise Voice over IP PBX is a product example to where the platform could fit nicely. It's required to operate in cramped spaces and must be silent during operation. Yet it needs to be powerful enough to handle telecommunication in a midsize or large company. 

Gaming and high-end Infotainment definitely have some applications where Core™ i5 and Core™ i7 will come out favourable in comparison to other processors. Where application requirements include compact size, high computing performance and advanced graphics in combination Core™ i5 or Core™ i7 are definitely competitive.

In conclusion, the introduction of Intel® Core™ i5 and Core™ i7 and the QM57 chipset provides an opportunity to introduce smaller form factor boards and COM modules with increased functionality and performance. The integration level of the CPU chip will be challenging when designing a cooling device in compact systems.

A number of small form factor motherboards will be introduced with computing performance levels and graphical functionality exceeding what's currently available in the embedded market place. The design strategy to use a COM module and a carrier board will be an option in a wider range of application areas and the trend towards semi-custom design will be reinforced. COM Express will be the dominating COM module form factor for Core™ i5 and Core™ i7.