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ARM versus X86
- Considerations for the embedded segment

White Paper
 
 
Embedded PC design in Northern Europe

Local

Presence

Embedded PC design close to you
Compact, cost-efficient with high-speed interfaces

Qseven

Modules

Versatile beyond expectations
In-house mechanical engineering

Mechanical

Development

Enclosures and system cooling
Carrier board design - Learn how to

Carrier Board Design

Introductions to the challenges involved
 
 
 
 
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.
 
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Welcome to Hectronic

Hectronic develops boards and embedded systems as both standard products and custom solutions.


We offer the fastest route to prototype delivery, in close contact with your development team during the development phase and a reliable production in quantities.

 
 
Quarterly news bulletin

Hectronic's quarterly bulletin

 
 
 
Case study: Perten »
Product angle: Flash »
 
 

IN FOCUS

Press release:

Hectronic announces industrial temperature range Qseven module with AMD Embedded G

The new H6059 version addresses the demand for CPU modules for harsh environments.  Additionally there is a new version of H6059 based on T16R, an APU with 4.5W TDP and 615MHz clock frequency.

Read press release »

H6059 product page »

 

White paper:

Industrial PCAP touch screen technology

PCAP touch is adaptation to modern user behavior. Embedded applications benefit from the look and feel of the latest mobile gadgets. This is how it works.
Read more » 

 

Press release:

Hectronic announces the H6818 COM Express Compact module based on third generation Intel® Core™ i3/i5/i7

H6818 offers increased performance per watt and improved graphics and media processing capabilities. The pin-out is type 6 for full utilization of the advantages in the processor platform.

Read press release »

H6818 product page »