"Custom designs that call for high computing performance packaged in a small, modular platform can benefit from the flexibility of integrating COM Express with a carrier board. Hectronic’s new H6052 module has a COM Express Type 2-compliant pinout and a feature set comprising all of the common interfaces used in the COM Express standard, including one PCI Express x16 and four PCI Express x1, four SATA, eight USB 2.0, 8-bit DIO, SDVO, and an LPC bus for legacy interfaces.

In addition to providing an onboard Intel 82577 GbE controller and Mobile Intel QM57/HM55 Express chipset, the module offers a range of CPU options from the Intel Core i3, i5, and i7 families. Increased 3D and video acceleration performance are enabled through the Intel Graphic Media Accelerator.

The H6052 includes one DDR3 SODIMM up to 4 GB of memory, one CRT interface, and 18/24-bit single/dual-channel LVDS support. Hectronic plans to release an extended temperature version of the module later this year."