COM Express Modules |
The COM Express computer-on-module form factor is a highly integrated and compact PC that can be used in applications much like an integrated circuit component. Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics, and Ethernet. All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module.
The specification defines 3 module sizes:
Compact: 95 mm x 95 mm
Basic: 95 mm x 125 mm
Extended: 110 mm x 155 mm |
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| VC1, MPEG-2, WMV9 amd H.264 decoding acc. |
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| Intel Atom D525/D425/N455 COM E. Compact |
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| Intel Atom D510/N450/D410 COM Express Compact |
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| Intel® Core™ i3/i5/i7 COM Express Compact |
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| Intel® Core™ 2 Duo COM E. Compact |
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| Intel® Core™ 2 Duo - TCG compliant HW |
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Hectronic H6312 Intel® Core™ 2 Duo COM E. Compact |
The H6312 COM Express module is based on Intel‘s 45nm dual core CPU technology enabling you to boost your embedded application to highest performance levels. Besides an extensive set of interfaces and features, the H6312 offers hardware and BIOS based security compliant to the requirements of TCG (Trusted Computing Group). The H6312 combines low voltage high performance processors and a compact Micro COM Express form factor, and is ideal for computing intensive, space constrained applications, with requirements for low power consumption and minimal heat dissipation. H6312 based on a selection of CPUs is available for extended temperature.
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Hectronic H6312 |
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| Click to enlarge the picture. |
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