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COM Express Modules

The COM Express computer-on-module form factor is a highly integrated and compact PC that can be used in applications much like an integrated circuit component. Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics, and Ethernet. All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module.

The specification defines 3 module sizes:
Compact: 95 mm x 95 mm
Basic: 95 mm x 125 mm
Extended: 110 mm x 155 mm
 
Hectronic H6816
Intel® Atom™ N2600/N2800/D2700 COM E. Compact
COMe-8X90
64-bit Nano E /X2 processor
Hectronic H6812
Intel® Atom™ D525/D425/N455 COM E. Compact
Hectronic H6215
Intel® Atom™ D510/N450/D410 COM Express Compact
Hectronic H6052
Intel® Core™ i3/i5/i7 COM Express Compact
Hectronic H6312
Intel® Core™ 2 Duo COM E. Compact
Hectronic H6309
Intel® Core™ 2 Duo - TCG compliant HW

Hectronic H6052

Intel® Core™ i3/i5/i7 COM Express Compact

 

This Micro COM Express module delivers increased CPU performance and graphics in a small form factor. The pinout is type 2 compliant. The H6052 has options including a range of LV and ULV processors from Intel® Core™ i3, Core™ i5 and Core™ i7 family of processors and Mobile Intel® HM55 Express Chipset. The feature set includes all interfaces in the COM Express standard such as PCI, PCI Express, SDVO and LVDS as well as an onboard Intel® 82577 Gigabit Ethernet Controller. There is a H6052 version specified for Extended Temperature (-20°C to +70°C).

 

Product Information

Datasheet
 

Product Documentation

Hardware Reference Guide - H6052
 

Related products

Hectronic H4113
H6052 Starter Kit
Extended Temperature COM Express Module
 
Hectronic is an affiliate member of the Intel Embedded Alliance, a community of embedded developers and solution providers.

Hectronic H6052

Hectronic H6052 - Intel® Core™ i3/i5/i7 Micro COM Express module
Click to enlarge the picture.
 
 

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