COM Express Modules |
The COM Express computer-on-module form factor is a highly integrated and compact PC that can be used in applications much like an integrated circuit component. Each module integrates core CPU and memory functionality, the common I/O of a PC/AT, USB, audio, graphics, and Ethernet. All I/O signals are mapped to two high density, low profile connectors on the bottom side of the module.
The specification defines 3 module sizes:
Compact: 95 mm x 95 mm
Basic: 95 mm x 125 mm
Extended: 110 mm x 155 mm |
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| VC1, MPEG-2, WMV9 amd H.264 decoding acc. |
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| Intel Atom D525/D425/N455 COM E. Compact |
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| Intel Atom D510/N450/D410 COM Express Compact |
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| Intel® Core™ i3/i5/i7 COM Express Compact |
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| Intel® Core™ 2 Duo COM E. Compact |
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| Intel® Core™ 2 Duo - TCG compliant HW |
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Hectronic H6052 Intel® Core™ i3/i5/i7 COM Express Compact |
This Micro COM Express module delivers increased CPU performance and graphics in a small form factor. The pinout is type 2 compliant. The H6052 has options including a range of LV and ULV processors from Intel® Core™ i3, Core™ i5 and Core™ i7 family of processors and Mobile Intel® HM55 Express Chipset. The feature set includes all interfaces in the COM Express standard such as PCI, PCI Express, SDVO and LVDS as well as an onboard Intel® 82577 Gigabit Ethernet Controller. There is a H6052 version specified for Extended Temperature (-20°C to +70°C). |
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Hectronic H6052 |
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| Click to enlarge the picture. |
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