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Quarterly Bulletin
 
Updates
 
2017-11-13    Product news: Hectronic H6075
 
Qseven module with Intel® Atom Apollo Lake™ SOC   
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2016-09-21    Product news: Hectronic H6839
 
COM Express module based on 6th generation Intel® Core (Skylake).   
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2016-08-17    Product news: Hectronic H6836
 
COM Express Basic based on 6th generation Intel® Core   
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2016-06-02    Product news: Hectronic H6911
 
2.5” Pico-ITX based on NXP/Freescale i.MX6   
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2016-05-16    Hectronic at ElektronikEXPO May 19th
 
Meet the Hectronic team at ElektronikEXPO in Västerås this Thursday.   
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2016-01-19    Bits & Pieces: ARM or X86 - Busting myths
 
Preconceived ideas are challenged by facts in this issue of the B&P bulletin. We're comparing performance, heat generation and cost for ARM and X86 processors in the low-end embedded segment.   
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2015-10-27    Bits & Pieces: Case Study - IoT to monitor air quality in Chinese Langfang
 
Contains case study from a project including Internet of Things, a presentation of building blocks from our TI Sitara platform as well as H6065, a Qseven module based on Intel Intel Atom E3800 series SOCs.   
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2015-06-11    Bits & Pieces bulletin: Case Study - COM and carrier board in next generation medical instrument
 
Contains case study from the medical technology market segment as well as an introduction to Steppe Eagle. It's the code name for new processor options within the AMD Embedded G-Series SOC improving performance. Hectronic launches two new COM modules based on Steppe Eagle processors.   
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2015-04-21    Hectronic launches new website
 
Among other things we’ve improved information access in the standard product catalogue as well as about the services we offer including development, production and maintenance of industrial computers. The overview of product features and access to datasheets are quicker. Browsing products based on operating temperature, processors and chipsets is easier. We hope to give you a pleasant and rewarding experience visiting our new website!   
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2015-03-31    Bits & Pieces March 2015: Internet of Things - Building a case
 
This issue of the B&P bulletin contains an article about Internet of things, a presentation of our experience from the transportation sector and the introduction of our brand new BSP for Android on TI Sitara.   
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2015-02-19    Embedded Conference Scandinavia Syd, March 10-11
 
Hectronic exhibitor at ECS, Malmömässan in Malmö, Sweden.   
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